Samsung in August unveiled two new flagship --Note 5 and S6 Edge +. Wherein S6 Edge + predecessors S6 Edge just over five months before the release, the Samsung quickly escalated S Edge series within six months, it is different from the usual strategy. So in addition to advertising in the gorgeous parameters, S6 edge + on the use of body stacked structure and internal components if there is a big upgrade? Here eWiseTech engineers dismantling comparison of two Edge series should be able to find the answer.
Compared with Galaxy S6 Edge, S6 Edge + screen size upgrade from 5.1 inches to 5.7 inches, there are subtle differences in appearance.
First S6 Edge + canceled infrared emitter top of the fuselage, the vertical position of the two microphones also changed, can be seen in the second frame portion S6 Edge + top and bottom slightly made some changes - in the middle part of the metal frame to join raised ridge design.
Then you eWiseTech engineer dismantling these two phones, look any different internal structure. (Hereinafter the left: Galaxy S6 Edge components right: Galaxy S6 Edge + parts)
Cover: cover two phones are the fourth generation Corning Gorilla Glass, a lot of glue on the frame by four weeks. EWiseTech engineer was measured, it was found S6 Edge cover thickness is about 0.73mm, S6 Edge + to be thin, about 0.59mm, so relatively speaking S6 Edge + glass cover more than S6 Edge a little thin.
NFC / wireless charging coil: coil secured by double-sided tape on the frame, the coil S6 Edge has six connection contacts, and S6 Edge + has 8 contacts on the connection. And more than a layer of graphite for cooling coils on + S6 Edge.
In box: the box by screws, injection molding material in two parts of the frame are PBT-GF40. S6 Edge + on both sides of the border than on both sides of the border S6 Edge thicker, stronger strength. On the fixation frame, the S6 Edge uses 13 screws, and S6 Edge + uses 18 screws.
Soft board module: There are some small changes in the way the soft-board components. Left S6 Edge of a soft board integrated LED lights, light / distance sense, handset and an infrared emitter, another piece of soft board is an integrated microphone one element; the right S6 Edge + of a soft board integrated LED lights, light perception / from the flu and a microphone, the other a soft board is a separate element integrated earpiece.
Battery: The battery is fixed by means of double-sided tape, S6 Edge battery capacity of 2600mAh, and S6 Edge + battery capacity of 3000mAh, which increases the 400mAh battery is mainly reflected in the area, almost all the same thickness.
Internal support: S6 Edge + processors and memory chips against the inner support of local graphite, the heat used to. The S6 Edge uses the same Exynos 7420 processor, but has no cooling solution. In addition S6 Edge + add a circle around the battery compartment reinforcing plate, after bending tests found the strength of the entire inner support is far higher than S6 Edge.
Screen: are used in Samsung's own Super AMOLED screen 2K resolution, but the size is 5.1 inches S6 Edge, S6 Edge + 5.7 inches. Touch chips are written in STMicroelectronics, but different models, S6Edge touch IC model is FT6BH, S6 Edge + of it is FT6AH.
Deputy board: S6 Edge and S6 Edge + are integrated sub-panel buttons, headphone jack, microphone and USB interface, but S6 Edge returned and multitasking buttons integrated directly in the deputy board; and S6 Edge + return and multi-tasking key is based on capacitive ring form soft board stuck to the inner support above and then covered with screen panel alignment marks on it key panel. So different from the S6 Edge is in order to remove the piece of sub-panels must be separated from the screen panels and inner support.
Board part: two very similar motherboard (except SIM card slot section), the chip on the motherboard uses mostly the same as the initial recognition eWiseTech engineer on board the IC, are the Samsung Exynos 7420 processor eight-core processor, Samsung Samsung S2MPS15 KLUBG4G1BD32GB flash and power management chips, Sijia inquiry SKY78042 mixed multimode multi-band front-end module, Wolfson's WM1840 audio chip, Bosch BMP280 pressure sensor, AKM's AK09911 three-axis electronic compass, Maxim's MAX77843 auxiliary power US letter MAX98505DG management chip audio amplifier PMD9635 Qualcomm power management chip and WTR3925RF transceiver, etc. Qualcomm.
Dismantling Summary:
GalaxyS6 Edge + compared with GalaxyS6 Edge, industrial design on the metal box plus the location of the raised ridge design, microphones were minor changes; eWiseTech team found key assembly as deputy board is not in the dismantling process Like, LED lights, light / from a sense of the way the earpiece and microphone integrated soft board is also different, other internal structure and layout are basically the same. But it is worth mentioning that the battery compartment section S6 Edge + inner circle increased support plate reinforcement plate, after bending test, the entire inner strength than the S6 Edge support than a mile, eWiseTech engineers infer that this should be out S6 Edge + increased in size, in order to improve the internal strength of the changes made in the machine.
About eWiseTech
eWiseTech focus dismantling and analysis of consumer electronics products, with an annual increment of 200 surplus products Electronic Technology database of corporate clients to provide lightweight electronic information product design information and analysis of large data full range of products, but also for electronic fans bring the most professional teardown analysis.
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